Chapter 26: Abrasive Machining and Finishing Operations¶
第二十六章：磨削加工与光整加工
26.1 Introduction (引言)¶
26.2 Abrasives and Bonded Abrasives (磨料与固结磨具)¶
- Aluminum oxide (氧化铝)
- Silicon carbide (碳化硅)
- CBN & Diamond (CBN与金刚石)
- Grain size (粒度)
- Bond types (结合剂): Vitrified (陶瓷), Resinoid (树脂), Metal (金属)
26.3 The Grinding Process (磨削工艺)¶
- Wheel wear (砂轮磨损)
- Truing and dressing (修整与修锐)
26.4 Grinding Operations and Machines (磨削操作与磨床)¶
- Surface grinding (平面磨削)
- Cylindrical grinding (外圆磨削)
- Internal grinding (内圆磨削)
- Centerless grinding (无心磨削)
- Creep-feed grinding (缓进给磨削)
26.5 Design Considerations for Grinding (磨削设计考量)¶
26.6 Ultrasonic Machining (超声加工)¶
26.7 Finishing Operations (光整加工)¶
- Honing (珩磨)
- Lapping (研磨)
- Superfinishing (超精加工)
- Polishing (抛光)
- Buffing (布轮抛光)
26.8 Deburring Operations (去毛刺)¶
- Vibratory finishing (振动光饰)
- Barrel finishing (滚筒光饰)
- Thermal energy deburring (热能去毛刺)