Chapter 28: Fabrication of Microelectronic Devices¶
第二十八章：微电子器件制造
28.1 Introduction (引言)¶
- Clean rooms (洁净室)
28.2 Semiconductor Materials and Substrates (半导体材料与衬底)¶
- Silicon wafers (硅晶圆) - Czochralski process (直拉法)
28.3 Crystal Growing and Wafer Preparation (晶体生长与晶圆制备)¶
28.4 Films and Film Deposition (薄膜与薄膜沉积)¶
- Oxidation (氧化)
- Physical vapor deposition (PVD) (物理气相沉积)
- Chemical vapor deposition (CVD) (化学气相沉积)
28.5 Oxidation (氧化)¶
28.6 Lithography (光刻)¶
- Photoresist (光刻胶)
- Photolithography (光学光刻)
- Electron-beam lithography (电子束光刻)
28.7 Etching (刻蚀)¶
- Wet etching (湿法刻蚀)
- Dry etching (Plasma etching) (干法刻蚀/等离子体刻蚀)
28.8 Diffusion and Ion Implantation (扩散与离子注入)¶
- Doping (掺杂)
28.9 Metallization and Testing (金属化与测试)¶
- Interconnects (互连)
28.10 Wire Bonding and Packaging (引线键合与封装)¶
- Wire bonding (打线)
- Flip-chip (倒装芯片)